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EVS-EN 61192-4:2003

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

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Kehtetu alates 02.05.2019
Alusdokumendid
IEC 61192-4:2002; EN 61192-4:2003
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Tüüp
Nimetus
01.09.2003
Põhitekst
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires
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