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EVS-EN 62137-3:2012

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

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Kehtiv alates 03.02.2012
Alusdokumendid
IEC 62137-3:2011; EN 62137-3:2012
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03.02.2012
Põhitekst
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
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